Mechanical Design Intern

About Us

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.

Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

About the Role

We have well-scoped mechanical support for radio testing campaign — Casing, CNC factoring, validation tooling, documentation — more work than current bandwidth allows in our team.

As a Mechanical Engineering Intern, you will contribute to the mechanical design and optimization of a new military device, focusing on ruggedness, miniaturization, radio frequency isolation and thermal management.

Our team needs someone who is able to add immediate engineering capacity to a high-priority project: developing the first-generation casing of a military radio for rapid integration into future autonomous defense systems. While the workload is highly structured and well-bounded for mentorship, the ability to take full ownership of a physical deliverable is key.

The duration of this internship is 6 months.

Responsibilities

• CAD Modeling: Develop precise CAD models for the external casing and internal component mounting to ensure optimal spatial integration (Shielding and thermal).

• Simulation & Validation: Conduct structural and thermal Finite Element Analysis (FEA) to validate designs against operational stress and heat loads.

• Environmental Sealing: Design and test robust sealing solutions to achieve the required IP ratings for dust and water protection.

• Material Selection: Source and evaluate high-performance materials suitable for deployment in military and rugged environments.

• Prototyping & Testing: Support the creation of physical prototypes and actively participate in environmental testing to verify field readiness (3D printing).

• Bonus: Knowledge in RF design specific to radio frequency electronics packaging, but not required.

Candidate Requirements

• Educational Background: Currently in final or penultimate year of a Master’s degree in Mechanical Engineering, or a related field

• Project Execution & Ownership: An adaptive learner with the ability to navigate tasks, offering creative solutions and collaborating effectively within a team to drive high-quality project results.

• Adaptability & Mobility: Thrives under pressure in a fast-paced, dynamic environment; embraces a “no-task-is-too-small” mentality.

• Communication & Influence : Excellent written and verbal communication, capable of leading diverse principals

• Commitment : 100% dedication to Harmattan AI’s mission, vision, and ambitious growth plans, ready to go the extra mile to ensure operational excellence.

We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.