PIC Packaging and Characterization Engineer @InSpek

WHO ARE WE

InSpek uses optical microchip technology to sense multiple molecules, temperature, acidity, oxygenation, and more in real time, directly at the heart of biochemical reactions. Our sensors help produce medicines, food, and energy while reducing waste. We make sensors better, cheaper, and smaller!

Do you want to join a young, dynamic, ambitious, and VC-backed startup?

Then InSpek is the place for you!

WHAT WILL YOU BE DOING

We are looking for a PIC Packaging and Characterization Engineer to own the physical realization of our PIC-based sensing probes — from PIC packaging through chip module characterization and supplier coordination. This is a broad, hands-on role at the intersection of photonics, fibre optics, and instrumentation. You will collaborate closely with our photonics and applications engineers and share optical testing responsibilities with the team. You will report to the Head of Photonics.

RESPONSABILITIES

• PIC packaging & assembly:

o PIC packaging: fibre-to-chip coupling, thermal and glue considerations

o Optical component sourcing and qualification (fibers, filters, isolators, laser sources).

o Troubleshoot optical system issues: coupling, polarization, alignment, signal noise.

o Own assembly protocols and process documentation; keep records current in internal tracking systems.

• Characterization & testing:

o Characterize chips and perform quality checks before and after packaging.

o Develop packaging process alongside packaging partners and in-house to optimize repeatability and yield.

• Supplier & manufacturing coordination:

o Coordinate packaging runs and assembly workflows with external subcontractors.

o Act as the primary technical contact with packaging subcontractors and component suppliers.

o Define technical requirements, review proposals, and manage incoming component validation.

o Manage procurement, timelines, and supplier documentation.

• Process & documentation:

o Build and maintain assembly protocols; ensure documentation is complete and traceable after each run.

o Support cross-functional debugging by maintaining clear records of what changed between runs.

COMPETENCIES / PROFIL

You are a versatile hands-on engineer with direct experience in PIC packaging and micro-systems, interested in system-level development. You enjoy working across multiple domains and are energized by versatility of work such as packaging, industrialisation and systems design. You have a wish to grow into a team lead, and bring competences to a growing team.

· 2+ years of industrial experience working with PIC-based products

· Hands-on experience in PIC packaging

· Comfortable working with PICs, optical fibres, and free-space optical components

· Practical experience with optical characterization tools (lasers, power-meters, spectrometers)

· Organized and precise — able to own a workflow end-to-end with good documentation habits

· Willing to work across domains and learn new understanding related to our field of application.

· Good communication skills; able to coordinate effectively with internal teams and external suppliers

· Fluency in English; French is a plus

· Nice-to-have:

o Experience with surface spotting or chip functionalization workflows

o Familiarity with Raman spectroscopy or laser-based sensing systems

BENEFITS

Health and life insurance (100%)

️ Meal vouchers

Gymlib account (access to gyms & sports)

Employee stock options (BSPCE)

Flexible remote work policy

Regular social events

Growth opportunities with potential for leadership roles

Inclusive culture

Unique opportunity to be an early employee at an innovative startup

InSpek’s offices & laboratories are located at DocCity Suresnes , in the western Paris region.

We welcome candidates from all backgrounds and experiences to apply, even if you don’t tick all the requirements.